Effect of additional dielectric layer and grounded shield on rf characteristics of GaAs microwave monolithic integrated circuit elements in 3D-integrated modules

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Abstract

The effect of coating GaAs monolithic integrated circuit with a benzocyclobutene dielectric layer and grounded copper shield is investigated. Using electromagnetic simulation up to 40 GHz, changes of RF characteristics of microstrip and coplanar transmission lines, a Marshand balun, and a bandpass filter due to coating are demonstrated. It is shown that from the performance variation viewpoint, the application of lines is preferred in GaAs monolithic integrated circuits used in 3D-integrated modules with such the coating.

About the authors

F. I. Sheyerman

Tomsk State University of Control Systems and Radioelectronics

Author for correspondence.
Email: fish@tusur.ru
Russian Federation, Lenin Avenue, 40, Tomsk, 634050

N. V. Goleneva

Tomsk State University of Control Systems and Radioelectronics

Email: fish@tusur.ru
Russian Federation, Lenin Avenue, 40, Tomsk, 634050

A. А. Kokolov

Tomsk State University of Control Systems and Radioelectronics

Email: fish@tusur.ru
Russian Federation, Lenin Avenue, 40, Tomsk, 634050

L. I. Babak

Tomsk State University of Control Systems and Radioelectronics

Email: fish@tusur.ru
Russian Federation, Lenin Avenue, 40, Tomsk, 634050

M. V. Cherkashin

Tomsk State University of Control Systems and Radioelectronics

Email: fish@tusur.ru
Russian Federation, Lenin Avenue, 40, Tomsk, 634050

P. V. Panasenko

SC «MERI»

Email: fish@tusur.ru
Russian Federation, Akademika Valieva Str., 6/1, Zelenograd, 124460

А. V. Volosov

SC «MERI»

Email: fish@tusur.ru
Russian Federation, Akademika Valieva Str., 6/1, Zelenograd, 124460

References

  1. Воробьев С. // Электроника НТБ. 2018. № 7. С. 142.
  2. Nguen C. Radio-frequency Integrated-circuit Engineering. New Jersey: John Wiley&Sons Inc., 2015.
  3. Банков С.Е., Курушин А.А. Электродинамика для пользователей САПР СВЧ. М.: Солон-Экспресс, 2017.
  4. Svensson С., Dermer G.E. // IEEE Trans. 2001. V. AP-24. № 2. P. 191.
  5. Djordjevic A.R., Biljic R.M., Likar-Smiljanic V.D., Sarkar T.K. // IEEE Trans. 2001. V. EC-43. № 4. P. 662.
  6. Huang С.H., Chen C.H., Horng T.S. // Proc. 2009 Asia Pacific Microwave Conf. Singapore. 7–10 Dec. N.Y.: IEEE, 2009. P. 1004.
  7. Маттей Д.Л., Янг Л., Джонс Е.М.Т. Фильтры СВЧ, согласующие цепи и цепи связи. М.: Связь, 1972.

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