New generation of solid state coolers
- Authors: Bulat L.P.1
-
Affiliations:
- St. Petersburg State University of Low Temperature and Food Technologies
- Issue: Vol 93, No 8 (2004)
- Pages: 2-7
- Section: Articles
- URL: https://freezetech.ru/0023-124X/article/view/100729
- DOI: https://doi.org/10.17816/RF100729
- ID: 100729
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Abstract
Recent developments in the field of solid-state cooling devices both thermoelectric (ТЕ) and thermionic ones (TI) are considered in the article. The development of quantum superlattice allows to design ТЕ microcoolers with the density of the removed heat flux upto 1 k W/cm2 for spot cooling of chips. Tunnel thermal diodes allow to improve TI coolers by bringing the density of the heat flux being removed to 5 k W/cm2 and the temperature to 150 K.
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About the authors
L. P. Bulat
St. Petersburg State University of Low Temperature and Food Technologies
Author for correspondence.
Email: info@eco-vector.com
Dr. Phys.-Math. Sciences
Russian FederationReferences
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1.
JATS XML
2.
Rice. 1. Production of thermoelectric refrigeration products for various purposes by different countries in % of global production (as of June 2003)
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Fig.2. Released thermal power Q as a function of computer microprocessor frequency f (according to INTEL Corporation)
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Fig.Z. Growth in the number of transistors in a computer microprocessor over the years, (according to INTEL Corporation)
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Fig.4. Thermoelectric (a) and thermionic (b) coolers: 1 — metal contacts; 2 - semiconductor thermoelement; 3 - heat conduction flow; 4 - electron flow; 5 - cathode; 6 - anode; 7 - vacuum gap
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Rice. 5. Two variants of thermoelements with point contacts: 1 — p-type semiconductor; 2 - n-type semiconductor; 3 - electrical insulating plate; 4 - hot side; 5 - cold side. Electric current is indicated by the letter I
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Rice. Fig. 6. Designs of thermionic coolers: a — Si/Ti/Ag/Cu sandwich; b — opened after freezing a sandwich of Si/Ti and Cu/Ag electrodes with the same surface relief and with a vacuum layer
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